Sensiron has introduced the SHTW2, its second-generation wafer-level chip-scale package (WLCSP) humidity sensor. The sensor comes in a flip chip package, which is one of the smallest ways of packaging a semiconductor chip and results in a footprint of only 1.3 x 0.7 x 0.5 mm3, the company claims.
The product is based on the company’s CMOSens Technology, which offers a complete sensor system on a single chip with a digital I2C interface. The sensor is fully calibrated and covers a humidity measurement range of 0 to 100 per cent RH and a temperature measurement of -30 to 100°C, with a typical accuracy of ± 3 per cent RH and ±0.4 °C.
Its operation voltage of 1.8V and low power consumption make the product suitable for integration in consumer electronics that run on tight power budgets, such as mobile phones, wearables and IoT applications, according to the company.